Disco, DAD-2H/6T, Automatic Semiconductor Wafer Dicing Saw, 3-Phase with Accessories.
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Due to the weight and sensitivity of this item, it will ship freight. The shipping weight is 1,300 lbs and the dimensions are 48″x40″x54″.
DISCLAIMER: Regardless of the origin of the equipment, documentation provided or identification appearing upon the equipment, the equipment described and offered here is in no way certified for, recommended for, or offered for any specific use. The purchaser agrees that the seller shall not be held responsible or liable for any injuries or damages, whether incidental or consequential, associated in any way with the equipment. The purchaser, by bidding on this equipment, indicates their acknowledgment of, and agreement to the terms of this disclaimer.